SEMICON Japan 2026
SEMI's Japanese semiconductor exhibition, with advanced packaging and chiplet programming for AI chips.
✓ Verified from the official event source. Dates and location were checked against the organizer's own website. Last checked: August 14, 2026. View source.
Attendance is an approximation based on recent editions; SEMI does not publish a visitor figure on the overview page.
About SEMICON Japan 2026
SEMICON Japan 2026 is held at Tokyo Big Sight from 9 to 11 December 2026 and is organised by SEMI Japan. The programme includes SuperTHEATER keynote presentations and concurrent summits covering advanced packaging and chiplets, advanced device integration, and metrology and inspection.
Who should attend
Attendees include semiconductor manufacturers, equipment and materials suppliers, packaging specialists and Japanese systems companies.
Why it matters
Japan is rebuilding domestic advanced logic and packaging capacity partly to serve AI accelerator demand. The advanced packaging and chiplet summit is directly relevant to how AI compute is manufactured and integrated.