Hot Interconnects 2026
IEEE Hot Interconnects 2026 (HOTI 33)
IEEE symposium on high-performance interconnects and fabrics, held virtually in 2026.
✓ Verified from the official event source. Dates and location were checked against the organizer's own website. Last checked: August 13, 2026. View source.
The 2026 edition is fully virtual, with no in-person venue.
About Hot Interconnects 2026
IEEE Hot Interconnects 2026 (HOTI 33) takes place August 19–21, 2026 as a fully virtual event. The 2026 edition carries the theme 'Scale-Up, Scale-Out, Scale-Across' and typically draws 300–600 participants.
Who should attend
Attendees include interconnect and fabric architects, NIC and switch vendors, and HPC network researchers.
Why it matters
Interconnect design now sets the practical limits on how far AI and HPC clusters can scale, and the 2026 theme addresses scaling within a node, across a cluster and between sites. The technical program is an early indicator of the fabric and storage network designs that later reach production systems.