Hot Interconnects 2027
IEEE Hot Interconnects 2027 (HOTI 34)
IEEE symposium on high-performance interconnects, fabrics and network architecture.
Dates not yet announced. The organizer has not published dates for this edition. The dates shown are projected from previous editions and have not been verified against an official source.
The dates shown are projected from the event's consistent late-August pattern; the venue is unannounced.
About Hot Interconnects 2027
IEEE Hot Interconnects 2027 (HOTI 34) is expected August 18–20, 2027 at a US location still to be announced. The symposium is small, at 300–600 attendees, and concentrates on interconnect and fabric architecture for high-performance and AI systems.
Who should attend
Attendees include interconnect and fabric architects, NIC and switch vendors, and HPC network researchers.
Why it matters
Fabric bandwidth, topology and congestion behavior increasingly set the practical ceiling on GPU cluster scaling. The symposium's focus on interconnect design connects directly to the network and I/O bottlenecks that constrain large AI training runs.